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 The Multiposition Wafer Probe combined with the RM3-AR Test Unit provides a high quality, easy to use system for measuring the sheet resistance and/or volume resistivity of wafers up to 200mm (8") in diameter. The Multiposition Wafer Probe has the ability to probe 1, 5, 9, or somewhat more positions on multiple wafers with 1mm positioning repeatability from wafer to wafer. It is not motorized, but requires that the user moves the wafer stage by hand. It is available with either a 6" (150mm) wafer chuck or an 8" (200mm) wafer chuck. The price is the same for either unit, however, the MWP-6 would be preferable for use with wafers that are 6" in diameter or smaller due to the increased ease of centering the wafer on the wafer chuck. The Multiposition Wafer Probe can be connected to a vacuum source for wafer hold-down. The instrument comprises a white powder-paint coated metal base carrying a Delrin column supporting the vertical slide, operating lever shaft, and micro-switch. The vertical slide carries the probe head, secured by a clamp screw. The probe head is positioned so that the micro-switch does not pass current until the probes have made contact, lost motion ensures that the current is switched off before the probes are raised. The wafer table slides towards the operator to enable the wafer to be centrally positioned, after which the vacuum control valve can be operated to secure it in position. Annular rings (not vacuum rings) allow wafers to be centered more easily. When the table is pushed to the limit of its travel, a measurement can be made at it's center. Four radial positions at right-angles are denoted by a spring-loaded index ball incorporated in the rotary table. The radial distance of measurement is denoted by a similar arrangement on the linear slide index plate. Unwanted settings can be blocked off by easily removed screws. So that, for example, one could choose to measure at the center and four points at 50mm radius. A grounded metal shield screens the wafer from light and electrical noise during measurement. It is arranged that the shield rises when the probe head is fully lifted to permit loading. The system incorporates the Jandel Cylindrical probe head which is built to high standards of quality and accuracy. A brochure regarding the Cylindrical probe can be found here: http://www.fourpointprobes.com/jandelcylindrical.pdf Information regarding the constructions and specifications of the Jandel Cylindrical probe can be seen here: http://www.fourpointprobes.com/cylindrical_app_notes.pdf Multiposition Wafer Probe Specifications:
The RM3-AR Test Unit is a specialty electronics instruments designed specifically for the four point probe measurement. It features high accuracy, an excellent range, and many features which simplify the four point probing measurement. The following are features of the RM3-AR Test Unit:
RM3-AR Specifications: Downloads: Instruction manual (155K PDF file) for the Multiposition Wafer Probe Instruction manual (688K PDF file) for the RM3-AR Test Unit High resolution image of Multipositon Wafer Probe and RM3-AR Test Unit (1meg JPG file) |
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| Four-Point-Probes is a division of Bridge Technology. To request further information please call Bridge Technology at (480) 988-2256 or send e-mail to Larry Bridge at: sales@bridgetec.com |
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